Calgary, AB
OptEM Engineering Inc. is a privately owned CAE (Computer-Aided Engineering) software and consulting services company specializing in the electromagnetic and signal integrity analysis of electronic interconnects. OptEM's head office is located in Calgary, Alberta (Canada). Our software and services focus on interconnect extraction, modeling and characterization of deep-submicron ICs, advanced IC packages, and connector/cable systems. Customers are located worldwide and support is conducted through the head office together with local distributors.
OptEM's software tools are specifically targeted to analyze interconnects of high-speed designs. Fabrication information and standard design datafiles are used throughout all of OptEM's software products to simplify the input process. On output, the software provides detailed parametric reports and plots, interconnect SPICE models, reflection and crosstalk values, S- parameters, and other critical information for design engineers.
The combination of shrinking feature size, increased packing density, increased interconnect length, and faster clock rates have created new challenges for engineers developing high- performance digital and analog systems. OptEM provides extraction, modeling, electromagnetic and signal integrity analysis solutions for today's design challenges. Contact us today at (403)289-0499 or e-mail info@optem. com for more information.
453 - 3553 - 31 St. NW
Calgary, AB T2L 2K7
CA
453 - 3553 - 31 St. NW
Calgary, AB T2L 2K7
CA
Legal Name: Optem Engineering Inc.
Number of Employees: 10
CA
Title: Manager
Area of Responsibility: Research/Development/Engineering
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Title: Manager
Area of Responsibility: Management Executive
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Title: President
Area of Responsibility: Management Executive
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Technical seminars and product training that include electromagnetic modelling, transmission line theory, and signal integrity analysis as applied to high-speed interconnect design.
Consulting services for IC package size optimization;
investigative modeling and analysis of defective cables;
submicron IC clock design and analysis; and other general interconnect modeling and signal integrity issues.
A software tool for the modeling and analysis of high- performance multi-conductor twisted-pair cables.
A software tool for the modelling and analysis of high-performance connectors and related interconnect media.
A device and interconnect RC extraction software tool for submicron analog, digital and mixed-signal IC designs.
A post layout software tool for the extraction, electromagnetic analysis, and modelling of package interconnects.
541510
Belgium, Germany, Japan, Netherlands, United Kingdom, United States
France, Italy, Portugal, Spain, Switzerland